Adhesive 3D Low Profile Positioning Board – Hydronic Applications

Description:
The Adhesive 3D Low Profile Positioning Board is specifically designed for use in hydronic installations to assist with the precise layout and stabilization of multilayer or PEX pipes during the installation phase. Thanks to its ultra-thin profile and strong adhesive backing, it ensures fast and secure positioning of pipes on a variety of surfaces, even in complex or tight spaces.

Key Features:

• Ultra Low Profile: Allows pipe positioning close to the surface, reducing space requirements and improving heat transfer when embedded in screed or underfloor systems.

• Adhesive Backing: Strong and reliable adhesive suitable for direct application on insulation panels, slabs, or walls—no mechanical fixings required.

• 3D Support Structure: Designed to accommodate and stabilize pipes in multiple directions, ensuring optimal curvature and layout.

• Time-Saving: Greatly speeds up pipe installation in floor heating/cooling systems or wall-mounted hydronic applications.

• Clean Application: Leaves no damage or residue on surfaces; suitable for temporary or permanent use.

Technical Specifications (example):

• Material: High-resistance polypropylene or nylon

• Adhesive: Industrial-grade pressure-sensitive adhesive

• Thickness: Approx. 3 mm

• Pipe Compatibility: Ø16 mm, Ø20 mm (other sizes available)

• Dimensions: 120 mm x 120 mm (standard)

• Temperature Resistance: -10°C to +70°C

Applications:

• Underfloor heating systems

• Wall or ceiling radiant panels

• Pipe layout and anchoring on insulation boards

• Hydronic cooling/heating embedded systems

• Renovation or retrofit hydronic works